In June 2026, Synopsys launched its AI-driven Multiphysics Fusion platform, combining its electronic design automation tools ...

Synopsys, Inc. (NASDAQ: SNPS) today announced availability of its first Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of ...

A chip design software helps engineers check power and electromagnetic effects together, reducing design time and improving ...

The engineers and researchers highlighted in COMSOL News 2026 use COMSOL Multiphysics® to meet their development goals, push ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

Ansys® RedHawk-SC™ is certified for TSMC's advanced 3nm process technology Ansys' comprehensive power, thermal, and reliability analysis enables mutual customers to meet key requirements for ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...

Enables SPICE-accurate multiphysics timing analysis with up to 3x faster runtimes. Delivers up to 10x faster design closure ...