Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

SolarSpace presented four high-efficiency module products and a portfolio of N-type solar cells in Munich, highlighting its ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

Recently, Trina Solar and industry experts studied empirical data from field tests, showing higher energy produced by bifacial Vertex ultra-high power modules in different environment. 20GW+ of Trina ...