EDN

Spring-probe test clips target TSOPII packages

If you've ever tenuously probed an expensive IC in a surface-mount package, you'll appreciate these new test adjuncts from Emulation Technology (ET—Santa Clara, Calif.). It's rolling out test clips ...
Electronic Design

Test Clips Employ Spring Probe Design

Exploiting a proven spring-probe design, the QUAD-4 test clip ensures secure, non-evasive contact for Micron TSOPII packaged ICs. It is designed to clip over surface-mounted DDR SDRAM memories in the ...
EDN

Probe card is designed for wafer-level packages

Yamaichi Electronics offer new products for the wafer-level test of VLSI semiconductors. The new development YVERTICAL® is a vertical probe card with miniaturised spring probe contacts designed for ...
Electronic Design

ECT reports ZIP spring probe wins head-to-head competition

Fontana, CA. Everett Charles Technologies (ECT) announced it has won a head-to-head evaluation using ZIP Z0-040 probes made with HyperCore material in a high-volume production environment at a large ...