Semiconductor Engineering

Panel-Level Packaging’s Second Wave Meets Engineering Reality

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.
AHA/ASA Journals

Targeting Interleukin-8–Mediated Cellular Crosstalk Reverses Hypertrophic Cardiomyopathy and Cardiac Fibrosis in Noonan Syndrome

BACKGROUND: Genetic variants in components or regulators of the RAS-MAPK signaling pathway are causative for severe and early-onset hypertrophic cardiomyopathy (HCM) in patients with Noonan syndrome ...
IEEE

Combined Surface Integral Equation Technique with RWG Basis Functions for the Analysis of a Class of Coax-Fed Dielectric Resonator Filters

Abstract: A combined electric field integral (EFIE) Poggio-Miller-Chang-Harrington-Wu-Tsai (PMCHWT) surface integral equation technique is presented, in which exclusively Rao-Wilton-Glisson (RWG) ...