IEEE

Silicon Dioxide Ring Innovations in TSV Structures: Analysis of Thermal-Mechanical and Signal Integrity for 3-D Chip Applications

Abstract: Through-silicon via (TSV) as a crucial interconnection microstructure in three-dimensional (3D) chip, have significantly enhanced device performance and reliability. However, the increasing ...
IEEE

Adaptive Machine Learning-Enabled Evolutionary Optimization for Reliability-Based Design of Through Silicon Via (TSV) Structures Under Uncertainty

Abstract: Through silicon via (TSV) technology has been widely employed as a promising 3-D packaging technology to achieve significant reduction in device dimensions. Due to the existence of ...
siliconcanals

I asked a retirement counselor why men fall apart within two years of retiring — she said it’s not boredom, it’s the first time their nervous system has no structure to ...

The conversation stopped me cold. A retirement counselor I’d met at a conference was explaining something that cut through every assumption I’d made about why retirement breaks so many men. “It’s not ...
C&EN

Electrical Response of Poly(N-[3-(dimethylamino)Propyl] Methacrylamide) to CO 2 at a Long Exposure Period

School of Chemical and Biomolecular Engineering, The University of Sydney, Sydney, NSW 2006, Australia The University of Sydney, Sydney Nano Institute, NSW 2006, Australia ...