Aluminum die-cast components are widely used in automotive and precision machinery applications due to their combination of ...
Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
Abstract: To address the performance bottleneck of highresolution mesh computation in the geometric simulation of milling processes, this paper proposes a surface mesh milling simulation acceleration ...
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